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document number: mc33290 rev. 7.0, 10/2006 freescale semiconductor technical data freescale semiconductor, inc. reserves the right to change the detai l specifications, as may be required, to permit improvements in the design of its products. ? freescale semiconductor, in c., 2006. all rights reserved. iso k line serial link interface the 33290 is a serial link bus interface device designed to provide bi-directional half-duplex communi cation interfacing in automotive diagnostic applications. it is designed to interface between the vehicle?s on-board micr ocontroller and systems off-board the vehicle via the special iso k line. the 33290 is designed to meet the diagnostic systems iso9141 specif ication. the device?s k line bus driver?s output is fully prot ected against bus shorts and overtemperature conditions. the 33290 derives its robustness to temperature and voltage extremes by being built on a sm artmos process, incorporating cmos logic, bipolar/mos analog circuitry, and dmos power fets. although the 33290 was principally designed for automotive applications, it is suited for other serial communication applications. it is parametrically specified over an ambient temperature range of -40oc t a 125oc and 8.0 v v bb 18 v supply. the economical so-8 surface-mount plastic package makes the 33290 very cost effective. features ? operates over wide supply voltage of 8.0 to 18 v ? operating temperature of -40 to 125 c ? interfaces directly to st andard cmos microprocessors ? iso k line pin protected against shorts to ground ? thermal shutdown with hysteresis ? iso k line pin capable of high currents ? iso k line can be driven with up to 10 nf of parasitic capacitance ? 8.0 kv esd protection attainable with few additional components ? standby mode: no v bat current drain with v dd at 5.0 v ? low current drain during operation with v dd at 5.0 v ? pb-free packaging designated by suffix code ef figure 1. 33290 simplified application diagram can physical interface d suffix ef suffix (pb-free) 98asb42564b 8-pin soicn 33290 ordering information device temperature range (t a ) package mc33290d/r2 -40 to 125c 8-soicn MCZ33290ef/r2 vdd d x scir x d scit x d v dd 33290 +v bat iso k-line r x d t x d mcu rx tx cen vdd vbb gnd iso
analog integrated circuit device data 2 freescale semiconductor 33290 internal block diagram internal block diagram figure 2. 33290 simplified block diagram vbb cen vdd tx rx iso 40 v thermal shutdown r hys master bias 6 4 3 1 8 7 5 3.0 k ? 20 v 50 v 10 v 10 v 10 v 10 v 2.0 k ? 200 ? gnd 125 k ? 125 k ?
analog integrated circuit device data freescale semiconductor 3 33290 pin connections pin connections figure 3. 33290 pin connections table 1. 33290 pin definitions pin number pin name definition 1 vbb battery power through external resistor and diode. 2 nc not to be connected. (1) 3 gnd common signal and power return. 4 iso bus connection. 5 tx logic level input for data to be transmitted on the bus. 6 rx logic output of data received on the bus. 7 vdd logic power source input. 8 cen chip enable. logic ?1? for active state. logic ?0? for sleep state. notes 1. nc pins should not have any connections made to them. nc pins are not guaranteed to be open circuits. 2 3 4 8 7 6 5 1 1 2 4 3 8 7 5 6 cen vdd tx vbb nc gnd iso rx
analog integrated circuit device data 4 freescale semiconductor 33290 electrical characteristics maximum ratings electrical characteristics maximum ratings table 2. maximum ratings all voltages are with respect to ground unless otherwise no ted. exceeding these ratings may cause a malfunction or permanent damage to the device. rating symbol value unit vdd dc supply voltage v dd -0.3 to 7.0 v vbb load dump peak voltage v bb(ld) 45 v iso pin load dump peak voltage (2) v iso 40 v iso short circuit current limit i iso(lim) 1.0 a esd voltage (3) human body model (4) machine model (4) v esd1 v esd2 2000 200 v iso clamp energy (5) e clamp 10 mj storage temperature t stg -55 to +150 c operating case temperature t c -40 to +125 c operating junction temperature t j -40 to +150 c power dissipation t a = 25 c p d 0.8 w peak package reflow temperature during reflow (6) , (7) t pprt note 7. c thermal resistance junction-to-ambient r ja 150 c/w notes 2. device will survive double battery jump start conditions in typica l applications for 10 minutes duration, but is not guarante ed to remain within specified parametric limits during this duration. 3. esd data available upon request. 4. esd1 testing is performed in accordance with the human body model (c zap = 100 pf, r zap = 1500 ? ), esd2 testing is performed in accordance with the machine model (c zap = 200 pf, r zap = 0 ? ). 5. nonrepetitive clamping capability at 25 c. 6. pin soldering temperature limit is for 10 seconds maximum duration. not designed fo r immersion soldering. exceeding these lim its may cause malfunction or permanent damage to the device. 7. freescale?s package reflow capability meets pb-free requirements for jedec standerd j-std-020c. for peak package reflow temperature and moisture sensitivity levels (msl), > go to www.freescale.com > search by part number [e.g. remove prefixes/suffixes and enter the core id to view all orderable parts. (i.e. mc33xxxd enter 33xxx)] > locate your part number and in the details column, select ?view? > select ?environmental and compliance information?
analog integrated circuit device data freescale semiconductor 5 33290 electrical characteristics static electrical characteristics static electrical characteristics table 3. static electrical characteristics characteristics noted under conditions of 4.75 v v dd 5.25 v, 8.0 v v bb 18 v, -40 c t c 125 c, unless otherwise noted. characteristic symbol min typ max unit power and control v dd sleep state current t x = 0.8 v dd , cen = 0.3 v dd i dd(ss) ? ? 0.1 ma v dd quiescent operating current t x = 0.2 v dd , cen = 0.7 v dd i dd(q) ? ? 1.0 ma v bb sleep state current v bb = 16 v, t x = 0.8 v dd , cen = 0.3 v dd i bb(ss) ? ? 50 a v bb quiescent operating current t x = 0.2 v dd , cen = 0.7 v dd i bb(q) ? ? 1.0 ma chip enable input high-voltage threshold (8) input low-voltage threshold (9) v ih(cen) v il(cen) 0.7 v dd ? ? ? ? 0.3 v dd v chip enable pull-down current (10) i pd(cen) 2.0 ? 40 a t x input low-voltage threshold r iso = 510 ? (11) v il(tx) ? ? 0.3 x v dd v t x input high-voltage threshold r iso = 510 ? (12) v ih(tx) 0.7 x v dd ? ? v t x pull-up current (13) i pu(tx) -40 ? -2.0 a r x output low-voltage threshold r iso = 510 ? , t x = 0.2 v dd , r x sinking 1.0 ma v ol(rx) ? ? 0.2 v dd v r x output high-voltage threshold r iso = 510 ? , t x = 0.8 v dd , r x sourcing 250 a v oh(rx) 0.8 v dd ? ? v thermal shutdown (14) t lim 150 170 ? c notes 8. when ibb transitions to >100 a. 9. when ibb transitions to <100 a. 10. enable pin has an internal current pull-down. pu ll-down current is measured with cen pin at 0.3 v dd . 11. measured by ramping t x down from 0.7 v dd and noting t x value at which iso falls below 0.2 v bb . 12. measured by ramping t x up from 0.3 v dd and noting the value at which iso rises above 0.9 v bb . 13. t x pin has internal current pull-up. pull-up current is measured with t x pin at 0.7 v dd . 14. thermal shutdown performance (t lim ) is guaranteed by design but not production tested .
analog integrated circuit device data 6 freescale semiconductor 33290 electrical characteristics static electrical characteristics table 3. static electrical characteristics (continued) characteristics noted under conditions of 4.75 v v dd 5.25 v, 8.0 v v bb 18 v, -40 c t c 125 c, unless otherwise noted. characteristic symbol min typ max unit iso i/o input low voltage threshold r iso = 0 ? , t x = 0.8 v dd (15) v il(iso) ? ? 0.4 x v bb v input high voltage threshold r iso = 0 ? , t x = 0.8 v dd (16) v ih(iso) 0.7 x v bb ? ? v input hysteresis (17) v hys(iso) 0.05 x v bb ? 0.1 x v bb v internal pull-up current r iso = ? , t x = 0.8 v dd , v iso = 9.0 v, v bb = 18 v i pu(iso) -5.0 ? -140 a short circuit current limit (18) r iso = 0 ? , t x = 0.4 v dd , v iso = v bb i sc(iso) 50 ? 1000 ma output low voltage r iso = 510 ? , t x = 0.2 v dd v ol(iso) ? ? 0.1 x v bb v output high voltage r iso = ? , t x = 0.8 v dd v oh(iso) 0.95 x v bb ? ? v notes 15. iso ramped from 0.8 v bb to 0.4 v bb , monitor r x , value of iso voltage at which r x transitions to 0.3 v dd . 16. iso ramped from 0.4 v bb to 0.8 v bb , monitor r x , value of iso voltage at which r x transitions to 0.7 v dd . 17. input hysteresis, v hys(iso) = v ih(iso) - v il(iso) . 18. iso has internal current limiting.
analog integrated circuit device data freescale semiconductor 7 33290 electrical characteristics dynamic electrical characteristics dynamic electrical characteristics table 4. dynamic electri cal characteristics characteristics noted under conditions of 4.75 v v dd 5.25 v, 8.0 v v bb 18 v, -40 c t c 125 c, unless otherwise noted. characteristic symbol min typ max unit fall time (19) r iso = 510 ? to v bb , c iso = 10 nf to ground t fall(iso) ? ? 2.0 s iso propagation delay (20) high to low: r iso = 510 ? , c iso = 500 pf (21) low to high: r iso = 510 ? , c iso = 500 pf (22) t pd(iso) ? ? ? ? 2.0 2.0 s notes 19. time required iso voltage to transition from 0.8 v bb to 0.2 v bb . 20. changes in the value of c iso affect the rise and fall time but have minimal effect on propagation delay. 21. step t x voltage from 0.2 v dd to 0.8 v dd . time measured from v ih(iso) until v iso reaches 0.3 v bb . 22. step t x voltage from 0.8 v dd to 0.2 v dd . time measured from v il(iso) until v iso reaches 0.7 v bb .
analog integrated circuit device data 8 freescale semiconductor 33290 electrical characteristics electrical performance curves electrical per formance curves figure 4. iso input threshold/v bb vs. temperature figure 5. iso output/v bb vs. temperature figure 6. iso fall time vs. temperature figure 7. iso propagation delay vs. temperature -50 0 50 100 150 0.475 0.5 0.525 0.55 0.575 0.6 t a , ambient temperature ( c) v ih ; v dd = 5.25 v, v bb = 18 v v ih ; v dd = 4.75 v, v bb = 8.0 v v il ; v dd = 5.25 v, v bb = 18 v v il ; v dd = 4.75 v, v bb = 8.0 v v il and v ih , input threshold (ra- -50 0 50 100 150 t a , ambient temperature ( c) 0.65 0.7 0.75 0.8 0.85 0.9 0.95 v dd = 5.25 v, v bb = 18 v v dd = 4.75 v, v bb = 8.0 v t fall(iso) , iso fall time ( s) v oh v ol t a , ambient temperature ( c) -50 0 50 100 150 0 0.2 0.4 0.6 0.8 1.0 1.2 v dd = 4.75 v, v bb = 8.0 v and v dd = 5.25 v, v bb = 18 v v ol and v oh , iso output (ratio) -50 0 50 100 150 t a , ambient temperature ( c) 0.2 0.3 0.4 0.5 0.6 0.7 pd h-l pd l-h v dd = 5.25 v, v bb = 18 v v dd = 4.75 v, v bb = 8.0 v v dd = 4.75 v, v bb = 8.0 v v dd = 5.25 v, v bb = 18 v t pd(iso) , propagation delay ( s)
analog integrated circuit device data freescale semiconductor 9 33290 typical applications introduction typical applications introduction the 33290 is a serial link bus interface device conforming to the iso 9141 physical bus specification. the device was designed for automotive envir onment usage compliant with on-board diagnostic (obd) requirements set forth by the california air resources board (carb) using the iso k line. the device does not incorporate an iso l line. it provides bi- directional half-duplex commun ications interfacing from a microcontroller to the communication bus. the 33290 incorporates circuitry to interface the digital translations from 5.0 v microcontroller logic levels to battery level logic and from battery level logic to 5.0 v logic levels. the 33290 is built using freescale semiconductor?s smartmos process and is packaged in an 8-pin plastic soic. functional description the 33290 transforms 5.0 v microcontroller logic signals to battery level logic signals and visa versa. the maximum data rate is set by the fall time and the rise time. the fall time is set by the output driver. the rise time is set by the bus capacitance and the pull-up resistors on the bus. the fall time of the 33290 allows data rates up to 150 kbps using a 30 percent maximum bit time transition value. the serial link interface will remain fully functional over a battery voltage range of 6.0 to 18 v. the device is parametrically specified over a dynamic v bb voltage range of 8.0 to 18 v. required input levels from the microcontroller are ratio- metric with the v dd voltage normally used to power the microcontroller. this enhances the 33290?s ability to remain in harmony with the r x and t x control input signals of the microcontroller. the r x and t x control inputs are compatible with standard 5.0 v cmos circuitry. for fault-tolerant purposes the t x input from the microcontroller has an internal passive pull-up to v dd , while the cen input has an internal passive pull-down to ground. a pull-up to battery is internally provided as well as an active data pull-down. the internal active pull-down is current-limit-protected against shorts to battery and further protected by thermal shutdown . typical applications have reverse battery protection by the incorporation of an external 510 ? pull-up resistor and diode to battery. reverse battery protection of the device is provided by using a reverse battery blocking diode (?d? in the simplified application diagram on page 1). battery line transient protection of the device is provided for by using a 45 v zener and a 500 ? resistor connected to the v bb source as shown in the same diagram. device esd protection from the communication lines exiting the module is through the use of the capacitor connected to the v bb device pin and the capacitor used in conjunction with the 27 v zener connected to the iso pin.
analog integrated circuit device data 10 freescale semiconductor 33290 packaging package dimensions packaging package dimensions for the most current package revision, visit www.freescale.com and perform a keyword search using the ?98a? listed below. d suffix ef suffix (pb-free) 8-pin plastic package 98asb42564b rev. u
analog integrated circuit device data freescale semiconductor 11 33290 revision history revision history revision date description of changes 6.0 7/2006 ? implemented revision history page ? converted to freescale format and updated to the prevailing for and style ? added pb-free suffix ef ? removed mc33290eg/r2 and replaced wit h MCZ33290eg/r2 in the ordering information block 7.0 10.2006 ? removed peak package reflow temperature during reflow (solder reflow) parameter from maximum ratings on page 4 . added note with instructions to obtain this information from www.freescale.com .
mc33290 rev. 7.0 10/2006 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc., 2006. all rights reserved. how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor literature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com rohs-compliant and/or pb-free versions of freescale products have the functionality and electrical characteristics of thei r non-rohs-compliant and/or non-pb-free counterparts. for further information, see http://www.freescale.com or contact your freescale sales representative. for information on freescale?s environmental products program, go to http:// www.freescale.com/epp .

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